Information

SB Payment Service Corp. (hereinafter "SBPS") will be exhibiting at the Tokyo venue of "Game Tools & Middleware Forum 2026 (GTMF 2026)," which is hosted by IID, Inc. and CRI Middleware Co., Ltd.
This time, we will be exhibiting a joint booth in collaboration with SoftBank Corp. We will be showcasing solutions that support game operators in solving their challenges and achieving business growth, focusing on mobile communication infrastructure and payment systems.

At the SBPS booth, we will be focusing on the themes of "out-of-app purchases x overseas payments x customer acquisition" to broadly support game operators in maximizing their revenue. Based on a robust system that can withstand high loads and a wealth of experience, we will provide end-to-end support, from improving profitability to overseas expansion and acquiring new users.

At the SoftBank booth, we will introduce our new mobile communication infrastructure technologies, "SRv6 MUP" and "MEC (Multi-Access Edge Computing)," which we are promoting. We will propose opportunities to create new business value by overcoming the limitations of conventional mobile communication infrastructure.

Additionally, we'll be holding a raffle exclusively for visitors, where you can win SoftBank mascot merchandise, so please feel free to stop by. We look forward to seeing you there!

Event overview

Tokyo Venue Booth Map

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Contact for inquiries regarding this matter

SB Payment Service Corp.